IPC-A-610 | Chapter 8 | Questions with 100 % Correct Answers | Verified

Rectangular or Square End Chip Components - 1,2,3 or 5 Side Termination(s) - End Joint Width (C) Acceptable - Class 3 - ️️End joint width (C) is minimum 75% of component termination (W) or 75% land width (P), whichever is less Staking Adhesive - Component Bonding Acceptable - Class 1 Process Indicator - Class 2 - ️️Adhesive material extending from under the component is visible in the termination area, but end joint width meets minimum requirements Staking Adhesive - Component Bonding Defect - Class 3 - ️️Adhesive materials extending from under the component are visible in the termination area Staking Adhesive - Component Bonding Acceptable - Class 1 Process Indicator - Class 2 - ️️Adhesive material extending from under the component is visible in the termination area, but end joint width meets minimum requirements Staking Adhesive - Mechanical Strength Acceptable - Class 1,2,3 - ️️- On round components adhesive adheres to a minimum 25% of the component height - On round components a minimum of three beads of staking material placed approximately evenly around the periphery of the component - Slight flow under the component body does not damage the components or affect form, fit and function Staking Adhesive - Mechanical Strength Not Established - Class 1 Defect - Class 2,3 - ️️On round components there are less than three beads of staking material Staking Adhesive - Mechanical Strength Defect - Class 1,2,3 - ️️Adhesive is not completely cured and homogemousQUESTION**: SMT Leads - Plastic Components - ️️Unless otherwise specified, solder shall not touch a package body or seal. Expectations are when a copper lead or termination configuration causes the solder fillet to contact a plastic component body, such as: - Plastic SOIC family (small outline packages such as SOT, SOD) SMT Leads - Damage Defect - Class 1,2,3 - ️️Lead is damaged or deformed more than 10% of the diameter, width or thickness of the lead SMT Leads - Flattening Acceptable - Class 1,2 Defect - Class 3 - ️️The thickness of the flattened lead is less than 40% of the original diameter SMT Connections - ️️- Components with surface and/or termination ends or sides that are not wettable by design are exempt from solder wetting requirements in those areas. Solder fillet wetting to the sides or ends of the leads is not required unless specifically stated. - Solder fillet may extend through the top bend. Solder should not extend under the body or surface mount components whose leads are made of Alloy 42 or similar metals. SMT Connections Acceptable - Class 1,2,3 - ️️Component titled/raised does not affect form, fit or function Chip Components - Bottom Only Terminations - Side Overhang (A) Acceptable - Class 3 - ️️Side overhang (A) is less than or equal to 25% width of component termination area (W) or 25% width of land (P), whichever is less Chip Components - Bottom Only Terminations - End Joint Width (C) Acceptable - Class 1,2 - ️️Minimum end joint width (C) is 50% width of component termination (W) or 50% width of land (P), whichever is less Chip Components - Bottom Only Terminations - End Joint Width (C) Acceptable Class 3 - ️️Minimum end joint width (C) is 75% width of component termination (W) or 75% width of land (P), whichever is less Chip Components - Bottom Only Terminations - End Overlap (J) Acceptable - Class 2 - ️️End overlap (J) between the component termination and the land is minimum 50% the length of component termination (R) Chip Components - Bottom Only Terminations - End OverlapAcceptable - Class 3 - ️️End overlap (J) between the component termination and the land is minimum 75% the length of component termination (R) Rectangular or Square End Clip Components - 1,2,3 or 5 Termination(s) - Side Overhang (A) Acceptable - Class 1,2 - ️️Side overhang (A) is less than or equal to 50% width of component termination area (W) or 50% width of land (P), whichever is less