IPC-A-610 | Chapter 8-Questions and Answers
Acceptable - Class 3 Correct Ans-End joint width (C) is minimum 75% of component
termination (W) or 75% land width (P), whichever is less
IPC-A-610 | Chapter 8-Questions and Answers
Acceptable - Class 3 Correct Ans-End joint width (C) is minimum 75% of component
termination (W) or 75% land width (P), whichever is less
Rectangular or Square End Chip Components - 1,2,3 or 5 Side Termination(s) - Side Joint
Length (D)
Acceptable - Class 1,2,3 Correct Ans-Side joint length is not required. However, a wetted
fillet is evident.
Rectangular or Square End Chip Components - 1,2,3 or 5 Side Termination(s) - Maximum Fillet
Height (E)
Acceptable - Class 1,2,3 Correct Ans-Maximum fillet height (E) may overhang the land
and/or extend onto the top or side metallization, but does not touch the top or side of the
component
Rectangular or Square End Chip Components - 1,2,3 or 5 Side Termination(s) - Minimum Fillet
Height (F)
Acceptable - Class 1,2 Correct Ans-Minimum fillet height (F) exhibits wetting on the
vertical surface(s) of the component termination
Rectangular or Square End Chip Components - 1,2,3 or 5 Side Termination(s) - Minimum Fillet
Height (F)
Acceptable - Class 3 Correct Ans-Minimum fillet height (F) is solder thickness (G) plus
either 25% termination height (H), or 0.5mm [0.02 in], whichever is less
Process Indicator - Class 2 Correct Ans-Adhesive material extending from under the
component is visible in the termination area, but end joint width meets minimum
requirements
Staking Adhesive - Component Bonding
Defect - Class 3 Correct Ans-Adhesive materials extending from under the component are
visible in the termination area
Staking Adhesive - Mechanical Strength
Acceptable - Class 1,2,3 Correct Ans-- On round components adhesive adheres to a
minimum 25% of the component height
- On round components a minimum of three beads of staking material placed approximately
evenly around the periphery of the component
- Slight flow under the component body does not damage the components or affect form, fit
and function
Staking Adhesive - Mechanical Strength
Not Established - Class 1
Defect - Class 2,3 Correct Ans-On round components there are less than three beads of
staking material
Defect - Class 1,2,3 Correct Ans-Adhesive is not completely cured and homogemous
QUESTION**: SMT Leads - Plastic Components Correct Ans-Unless otherwise specified,
solder shall not touch a package body or seal. Expectations are when a copper lead or
termination configuration causes the solder fillet to contact a plastic component body, such
as:
- Plastic SOIC family (small outline packages such as SOT, SOD)
SMT Leads - Damage
Defect - Class 1,2,3 Correct Ans-Lead is damaged or deformed more than 10% of the
diameter, width or thickness of the lead
SMT Leads - Flattening
Acceptable - Class 1,2
Defect - Class 3 Correct Ans-The thickness of the flattened lead is less than 40% of the
original diameter
SMT Connections Correct Ans-- Components with surface and/or termination ends or sides
that are not wettable by design are exempt from solder wetting requirements in those areas.
Solder fillet wetting to the sides or ends of the leads is not required unless specifically stated.
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