Exam (elaborations)

IPC-A-610 - Chapter 7 Study Guide with Complete Solutions

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IPC-A-610 - Chapter 7 Study Guide with Complete Solutions Through-Hole Technology - Answer-- The placement of any component on the electronic assembly does not prevent the insertion or removal of any hardware (tool clearance included) used to mount the assembly - Bonding material is sufficient...

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ipc a 610 chapter 7 study guide with complete so

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IPC-A-610 - Chapter 7 Study Guide with
Complete Solutions

Through-Hole Technology - Answer✔✔-- The placement of any component on the electronic

assembly does not prevent the insertion or removal of any hardware (tool clearance included)

used to mount the assembly

- Bonding material is sufficient to hold the part but does not encapsulate and cover component

identification

Connection Mounting - Orientation - Answer✔✔-Inspection usually starts with a general overall

view of the electronic assembly, then follows each component/wire to its connection,

concentrating on the lead into the connection, the connection and the tail end of the lead/wire

leaving the connection. The wire/lead protrusion step for all lands should be saved for last so

that the board can be flipped over and all connections checked together.

*Component Mounting - Orientation - Horizontal

Target - Class 1,2,3 - Answer✔✔-Nonpolarized components are oriented so that markings are

read the same way (left-to-right or top-to-bottom)

Component Mounting - Orientation - Vertical

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Acceptable - Class 1,2,3 - Answer✔✔-- Polarized part is mounted with a long ground lead

- Nonpolarized component markings read from bottom to top

Component Mounting - Lead Forming

Defect - Class 1,2,3 - Answer✔✔-Lead is kinked

Component Mounting - Lead Forming - Space between Seal/Weld and Bend

Acceptable - Class 1,2,3 - Answer✔✔-Leads of through-hole mounted component extend at

least one diameter or thickness but not less than 0.8 mm [0.03 in] from the body, solder bead,

or lead weld

Component Mounting - Lead Forming - Space between Seal/Weld and Bend

Defect - Class 1,2,3 - Answer✔✔-Fractured lead weld, solder bead, or component body lead seal

Component Mounting - Lead Forming - Stress Relief - Answer✔✔-- With camel hump bends.

Configuration incorporating a single camel hump may have the body positioned off-center.

- Loop bends may be used if the location of the mounting holes prevents the use of a standard

bend if there is no possibility of shortening the lead to any adjacent component lead or

conductor. Use of loop bends may impact circuit impedance, etc., and shall be approved by

design engineering

Component Mounting - Lead Forming - Stress Relief

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Acceptable - Class 1,2,3 - Answer✔✔-- Component lead exiting component body is

approximately parallel to major body axis

- Component centering may be offset as a result of the type of stress relief bond

Component Mounting - Lead Forming - Stress Relief

Acceptable - Class 1

Process Indicator - Class 2

Defect - Class 3 - Answer✔✔-Lead bends less than one diameter or thickness but less than

0.8mm [0.03 in] away from body seal

Component Mounting - Lead Forming - Damage

Acceptable - Class 1,2,3 - Answer✔✔-No nicks or deformation exceeding 10% of the diameter,

width or thickness of the lead

Component Mounting - Lead Forming - Damage

Defect - Class 1,2,3 - Answer✔✔-Heavy indentations such as serrated pliers mark

Component Mounting - Leads Crossing Conductors

Acceptable - Class 1,2,3 - Answer✔✔-- Sleeve does not interfere with formation of the required

solder connection

- Sleeve covers area of protection designated

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