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IPC-A-610 | Chapter 8 | Questions with 100 % Correct Answers | Verified
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Rectangular or Square End Chip Components - 1,2,3 or 5 Side Termination(s) - End Joint Width (C) Acceptable - Class 3 - ️️End joint width (C) is minimum 75% of component termination (W) or 75% land width (P), whichever is less Staking Adhesive - Component Bonding Acceptable - Class 1 Proc...

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  • September 30, 2024
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  • 2024/2025
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  • IPC-A-610
  • IPC-A-610

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IPC-A-610 | Chapter 8
Rectangular or Square End Chip Components - 1,2,3 or 5 Side Termination(s) - End
Joint Width (C)
Acceptable - Class 3 - ✔️✔️End joint width (C) is minimum 75% of component
termination (W) or 75% land width (P), whichever is less



Staking Adhesive - Component Bonding
Acceptable - Class 1
Process Indicator - Class 2 - ✔️✔️Adhesive material extending from under the
component is visible in the termination area, but end joint width meets minimum
requirements

Staking Adhesive - Component Bonding
Defect - Class 3 - ✔️✔️Adhesive materials extending from under the component are
visible in the termination area

Staking Adhesive - Component Bonding
Acceptable - Class 1
Process Indicator - Class 2 - ✔️✔️Adhesive material extending from under the
component is visible in the termination area, but end joint width meets minimum
requirements

Staking Adhesive - Mechanical Strength
Acceptable - Class 1,2,3 - ✔️✔️- On round components adhesive adheres to a
minimum 25% of the component height
- On round components a minimum of three beads of staking material placed
approximately evenly around the periphery of the component
- Slight flow under the component body does not damage the components or affect
form, fit and function

Staking Adhesive - Mechanical Strength
Not Established - Class 1
Defect - Class 2,3 - ✔️✔️On round components there are less than three beads of
staking material

Staking Adhesive - Mechanical Strength
Defect - Class 1,2,3 - ✔️✔️Adhesive is not completely cured and homogemous

, QUESTION**: SMT Leads - Plastic Components - ✔️✔️Unless otherwise specified,
solder shall not touch a package body or seal. Expectations are when a copper lead or
termination configuration causes the solder fillet to contact a plastic component body,
such as:

- Plastic SOIC family (small outline packages such as SOT, SOD)

SMT Leads - Damage
Defect - Class 1,2,3 - ✔️✔️Lead is damaged or deformed more than 10% of the
diameter, width or thickness of the lead

SMT Leads - Flattening
Acceptable - Class 1,2
Defect - Class 3 - ✔️✔️The thickness of the flattened lead is less than 40% of the
original diameter

SMT Connections - ✔️✔️- Components with surface and/or termination ends or sides
that are not wettable by design are exempt from solder wetting requirements in those
areas. Solder fillet wetting to the sides or ends of the leads is not required unless
specifically stated.
- Solder fillet may extend through the top bend. Solder should not extend under the
body or surface mount components whose leads are made of Alloy 42 or similar metals.

SMT Connections
Acceptable - Class 1,2,3 - ✔️✔️Component titled/raised does not affect form, fit or
function


Chip Components - Bottom Only Terminations - Side Overhang (A)
Acceptable - Class 3 - ✔️✔️Side overhang (A) is less than or equal to 25% width of
component termination area (W) or 25% width of land (P), whichever is less

Chip Components - Bottom Only Terminations - End Joint Width (C)
Acceptable - Class 1,2 - ✔️✔️Minimum end joint width (C) is 50% width of component
termination (W) or 50% width of land (P), whichever is less

Chip Components - Bottom Only Terminations - End Joint Width (C)
Acceptable Class 3 - ✔️✔️Minimum end joint width (C) is 75% width of component
termination (W) or 75% width of land (P), whichever is less

Chip Components - Bottom Only Terminations - End Overlap (J)
Acceptable - Class 2 - ✔️✔️End overlap (J) between the component termination and
the land is minimum 50% the length of component termination (R)

Chip Components - Bottom Only Terminations - End Overlap

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