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IPC-A-610 | Chapter 8 Study Guide with Complete Solutions

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IPC-A-610 | Chapter 8 Study Guide with Complete Solutions Staking Adhesive - Component Bonding Acceptable - Class 1 Process Indicator - Class 2 - Answer-Adhesive material extending from under the component is visible in the termination area, but end joint width meets minimum requirements Stak...

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  • October 15, 2024
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IPC-A-610 | Chapter 8 Study Guide with
Complete Solutions

Staking Adhesive - Component Bonding


Acceptable - Class 1


Process Indicator - Class 2 - Answer✔✔-Adhesive material extending from under the component

is visible in the termination area, but end joint width meets minimum requirements


Staking Adhesive - Component Bonding


Defect - Class 3 - Answer✔✔-Adhesive materials extending from under the component are

visible in the termination area


Staking Adhesive - Mechanical Strength


Acceptable - Class 1,2,3 - Answer✔✔-- On round components adhesive adheres to a minimum

25% of the component height


- On round components a minimum of three beads of staking material placed approximately

evenly around the periphery of the component


- Slight flow under the component body does not damage the components or affect form, fit

and function
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RESERVED. FIRST PUBLISH OCTOBER, 2024

Staking Adhesive - Mechanical Strength


Not Established - Class 1


Defect - Class 2,3 - Answer✔✔-On round components there are less than three beads of staking

material


Staking Adhesive - Mechanical Strength


Defect - Class 1,2,3 - Answer✔✔-Adhesive is not completely cured and homogemous


QUESTION**: SMT Leads - Plastic Components - Answer✔✔-Unless otherwise specified, solder

shall not touch a package body or seal. Expectations are when a copper lead or termination

configuration causes the solder fillet to contact a plastic component body, such as:




- Plastic SOIC family (small outline packages such as SOT, SOD)


SMT Leads - Damage


Defect - Class 1,2,3 - Answer✔✔-Lead is damaged or deformed more than 10% of the diameter,

width or thickness of the lead


SMT Leads - Flattening


Acceptable - Class 1,2




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Defect - Class 3 - Answer✔✔-The thickness of the flattened lead is less than 40% of the original

diameter


SMT Connections - Answer✔✔-- Components with surface and/or termination ends or sides

that are not wettable by design are exempt from solder wetting requirements in those areas.

Solder fillet wetting to the sides or ends of the leads is not required unless specifically stated.


- Solder fillet may extend through the top bend. Solder should not extend under the body or

surface mount components whose leads are made of Alloy 42 or similar metals.


SMT Connections


Acceptable - Class 1,2,3 - Answer✔✔-Component titled/raised does not affect form, fit or

function


Chip Components - Bottom Only Terminations - Side Overhang (A)


Acceptable - Class 1,2 - Answer✔✔-Side overhang (A) is less than or equal to 50% width of

component termination area (W) or 50% width of land (P), whichever is less


Chip Components - Bottom Only Terminations - Side Overhang (A)


Acceptable - Class 3 - Answer✔✔-Side overhang (A) is less than or equal to 25% width of

component termination area (W) or 25% width of land (P), whichever is less


Chip Components - Bottom Only Terminations - End Joint Width (C)



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