IPC-A-610 - Chapter 7 Questions and Correct Answers the Latest Update and Recommended Version
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Course
IPC-A-610
Institution
IPC-A-610
Through-Hole Technology
- The placement of any component on the electronic assembly does not prevent the
insertion or removal of any hardware (tool clearance included) used to mount the
assembly
- Bonding material is sufficient to hold the part but does not encapsulate and cover
component...
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IPC-A-610 - Chapter 7 Questions and
Correct Answers the Latest Update and
Recommended Version
Through-Hole Technology
✓ - The placement of any component on the electronic assembly does not prevent the
insertion or removal of any hardware (tool clearance included) used to mount the
assembly
✓ - Bonding material is sufficient to hold the part but does not encapsulate and cover
component identification
Connection Mounting - Orientation
✓ Inspection usually starts with a general overall view of the electronic assembly, then
follows each component/wire to its connection, concentrating on the lead into the
connection, the connection and the tail end of the lead/wire leaving the connection. The
wire/lead protrusion step for all lands should be saved for last so that the board can be
flipped over and all connections checked together.
*Component Mounting - Orientation - Horizontal
Target - Class 1,2,3
✓ Nonpolarized components are oriented so that markings are read the same way (left-to-
right or top-to-bottom)
Component Mounting - Orientation - Vertical
Acceptable - Class 1,2,3
✓ - Polarized part is mounted with a long ground lead
✓ - Nonpolarized component markings read from bottom to top
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Defect - Class 1,2,3
✓ Lead is kinked
Component Mounting - Lead Forming - Space between Seal/Weld and Bend
Acceptable - Class 1,2,3
✓ Leads of through-hole mounted component extend at least one diameter or thickness but
not less than 0.8 mm [0.03 in] from the body, solder bead, or lead weld
Component Mounting - Lead Forming - Space between Seal/Weld and Bend
Defect - Class 1,2,3
✓ Fractured lead weld, solder bead, or component body lead seal
Component Mounting - Lead Forming - Stress Relief
✓ - With camel hump bends. Configuration incorporating a single camel hump may have the
body positioned off-center.
✓ - Loop bends may be used if the location of the mounting holes prevents the use of a
standard bend if there is no possibility of shortening the lead to any adjacent component
lead or conductor. Use of loop bends may impact circuit impedance, etc., and shall be
approved by design engineering
Component Mounting - Lead Forming - Stress Relief
Acceptable - Class 1,2,3
✓ - Component lead exiting component body is approximately parallel to major body axis
✓ - Component centering may be offset as a result of the type of stress relief bond
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