Exam (elaborations)
IMSE 250 Quiz 22 (1).
- Course
- FPC Chapter 2.2 & 2.3
- Institution
- FPC Chapter 2.2 & 2.3
IMSE 250 Quiz 22 (1).
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IMSE 250 Quiz 22IC Fabrication involves five general stages. Crystal growing is in the stage of _________
(A) Wafer preparation. (B) Wafer fabrication. (C) Wafer test/sort.
(D) Assembly and packaging. (E) Final test. - ANS-A
IC Fabrication involves five general stages. Photolithography is in the stage of _________
(A) Wafer preparation. (B) Wafer fabrication. (C) Wafer test/sort.
(D) Assembly and packaging. (E) Final test. - ANS-B
You are at SEMICON West (the premier annual event for the global microelectronics industry)
where companies exhibit their products. You are interested in buying a CMP machine for your
company. Where should you look for CMP machines?
(A) Front end processes. (B) Back end processes. - ANS-A
Which one of the following processes involves separating each good die from the wafer?
(A) Wafer sort testing. (B) Final assembly. (C) Packaging. - ANS-B
Among the following three back end IC manufacturing processes, which one is the last step?
(A) Wafer sort testing. (B) Final assembly. (C) Packaging. - ANS-C
IC and PCB (Printed circuit boards) are two terms that _____ be used interchangeably.
(A) can (B) cannot - ANS-B
There are two different packaging levels for electronic components. The first level packaging is
the chip assembly and packaging. In the second level packaging, the IC component is
assembled onto a PCB (printed circuit board). The figure above shows a typical product after
which level of packaging?
(A) First level. (B) Second level. - ANS-B
The completed chips are loaded on burning boards and then put into ovens. The chips will be
stressed far beyond normal conditions. The purpose of doing so is to _______
(A) strain harden the chips so they will have higher strength.
(B) force the weak chips to fail prematurely before they are put into products. - ANS-B
In burning oven, the chips will be powered up to expose high temperatures for several hours.
The purpose of doing so is to ____________
(A) encourage potential defects to occur faster.
(B) heal (fix) the defects in these chips. - ANS-A
___________ is used to mount IC components on printed circuit boards (PCB).
(A) Soldering (B) Brazing (C) Welding - ANS-A
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