IMSE 250 Quiz 20 (1)

IMSE 250 Quiz 20
The orientation of the surface shown in the figure is ____.
(A) (111).
(B) (101).
(C) (110). - ANS-A

What will determine the diameter of the boule during crystal growth?
(A) Temperature.
(B) Pull rate.
(C) Rotating speed of the seed. - ANS-B

If you want a larger boule diameter, which pull rate should be used?
(A) Faster.
(B) Slower. - ANS-B

Which one is not the purpose of boule shaping process?
(A) Decrease the surface roughness of boule surface.
(B) Obtain the uniform boule shape.
(C) Generate flats to identify the front and back surfaces. - ANS-A

Between wire-sawing and ID sawing, which one yields more wafers per unit length of crystal
ingot?
(A) Wire sawing. (B) ID sawing. - ANS-A

Warped wafer will be generated from both ID saw and wire saw.
(A) True. (B) False. - ANS-A

Between lapping and grinding, which one has higher MRR?
(A) Lapping. (B) Grinding. - ANS-B

Between lapping and grinding, which one use fixed abrasives?
(A) Lapping. (B) Grinding. - ANS-B

In lapping process, the material of lapping plate is _____ than the wafer material.
(A) Harder (B) Softer - ANS-B

The abrasive particles used in polishing process are _____ than those used in lapping?
(A) Smaller. (B) Larger. - ANS-A