UNIT 22: ELECTRONIC PRINTED CIRCUIT BOARD DESIGN AND MANUFACTURE
Unit 22: Electronic Printed Circuit Board Design
and Manufacture
Level: 3
Unit type: Internal
Guided learning hours: 60
Unit in brief
Learners will explore and develop the design and manufacture of electronic printed circuit boards
(PCBs). This unit does not cover the design of circuits.
Unit introduction
Electronic products are everywhere, from toasters to computer tablets, and at the heart of these
devices are ever more complex electronic circuits. To make these products function as intended
(reliably and safely), the circuits need to be connected effectively; and this is the job of a PCB.
As well as making all of the required electrical connections that join the components together, a
PCB must also physically support the components. PCBs might also comprise some user controls
or a display, and can be designed to help protect the circuit from excess heat or interference.
In this unit, you will understand and explore the industrial processes involved in designing and
manufacturing sustainable PCBs. You will gain an understanding of the different types of PCB and
the design considerations for an electronic product or system. You will experiment with software
tools to design and simulate the PCB, before safely producing a PCB that you will then examine to
assess its functionality and build quality. Finally, you will reflect on the skills and understanding
you have acquired while designing and manufacturing a PCB, and the behaviours applied.
It is the role of electronic design engineers to examine and analyse the diverse product and system
requirements and then to develop effective, efficient and sustainable solutions, ensuring optimal
performance. This unit will help to prepare you for employment and apprenticeships in electronic
and electrical engineering and, in particular, electronic product design and manufacture. You may
also be interested in this unit if you want to progress to higher education to study engineering.
Learning aims
In this unit you will:
A Examine the design and manufacture of printed circuit boards that are widely used
in industry
B Explore how computer software is used for schematic capture and simulation of an
electronic circuit
C Develop safely a printed circuit board to solve an engineering problem
D Review the development of the printed circuit board and reflect on own
performance.
Pearson BTEC Level 3 National Extended Diplomas in Engineering – 273
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,UNIT 22: ELECTRONIC PRINTED CIRCUIT BOARD DESIGN AND MANUFACTURE
Summary of unit
Learning aim Key content areas Recommended
assessment approach
A Examine the design and A1 PCB types, technologies
manufacture of printed and applications
circuit boards that are A2 Characteristics of printed A written report or formal
widely used in industry circuit boards presentation detailing the
A3 Heat gain and thermal PCB technology, characteristics
management and thermal management
techniques employed in
A4 Manufacturing processes electronic products, including
A5 Quality control methods a description of the relevant
A6 Sustainability and manufacturing processes and
environmental quality control methods.
considerations
B Explore how computer B1 Schematic capture Evidence of computer-based
software is used for B2 Circuit simulation activities capturing and
schematic capture and simulating direct current (DC)
simulation of an electronic and alternating current (AC)
circuits, or a complex circuit
circuit
containing DC and AC
elements; witness statements
accompanied by annotated
screenshots, printouts and
data generated.
C Develop safely a printed C1 PCB design A reflective developmental
circuit board to solve an C2 Health and safety log detailing the design,
engineering problem requirements when manufacture and testing
manufacturing a PCB process undertaken. This
should be accompanied by one
C3 Risk assessment
or more observational witness
C4 Manufacture of a single- statements, photographic
sided PCB evidence, a formal assessment
of the final circuit board and
D Review the development of D1 Lessons learned from
relevant behaviours applied.
the printed circuit board developing a PCB
The portfolio of evidence
and reflect on own D2 Personal performance
learners’ generate while
performance while developing a PCB
developing a printed circuit
board and reviewing the
processes and reflecting on
own performance
274 Pearson BTEC Level 3 National Extended Diplomas in Engineering –
Specification – Issue 8 – May 2021 © Pearson Education Limited 2021
, UNIT 22: ELECTRONIC PRINTED CIRCUIT BOARD DESIGN AND MANUFACTURE
Content
Learning aim A: Examine the design and manufacture of printed circuit boards
that are widely used in industry
A1 PCB types, technologies and applications
x Types of PCB and their technology: through hole (THC), surface mount (SMT),
mixed-technology boards, single and multiple layer/sided boards, rigid, flexible and
membrane PCBs and chip-on-board (COB).
x Typical PCB applications, e.g. multimedia devices, computing, household electrical
items/white goods, industrial processes, aerospace, and medical, influence the choice of
manufacturing technology and characteristics of the PCB.
A2 Characteristics of PCBs
x Characteristics of the different PCB technologies, including physical size and component
density, composition and materials used, ease of mass manufacture, component
availability and cost, design complexity, connectivity and interconnection, radio frequency
immunity, mechanical characteristics, ease of rework and power handling capability.
x Justification of the technology used for different applications based on design requirements
and circuit board characteristics.
A3 Heat gain and thermal management
x Causes of heat generation, e.g. resistance, internal resistance, semiconductor junction.
x Consequences of excess heat gain and thermal cycling, e.g. component failure,
reduced product life span, changes to components’ electrical characteristics, de-soldering,
material property changes, physical stresses, safety, usability issues.
x Thermal management methods:
o heat dissipation methods, including heat sinks, fins/cavities, heat pipe, air and liquid
cooling, Peltier plate, case/enclosure design, and thermal interface efficiency
(component mounting and thermal compound)
o heat efficient PCB design, e.g. component placement (geographic and relative to
other components), component density, heat dissipation via board/copper,
consideration of enclosure fixtures/features
o thermal rating conventions and typical values for simple heat dissipation devices.
A4 Manufacturing processes
PCB mass manufacturing processes:
x artwork production (photo/laser)
x drilling (manual/automated)
x chemical processes: exposure, developing, electroplating and etching
x component placement: manual insertion and automated pick and place
x soldering techniques: hand, selective, wave and reflow
x solder mask over bare copper (SMOBC)
x silkscreen
x punching, routing, scoring
x Institute for Printed Circuits (IPC) standards or other relevant international equivalents.
A5 Quality control methods
x Quality control methods used in the batch and mass manufacture of PCBs including:
visual inspection techniques (manual/assisted), automated optical inspection (AOI),
x-ray, automated test equipment (ATE), electrical testing, flying probe and test
fixtures/’bed of nails’, functional testing, standards conformity testing, e.g.
electromagnetic compatibility (EMC).
Pearson BTEC Level 3 National Extended Diplomas in Engineering – 275
Specification – Issue 8 – May 2021 © Pearson Education Limited 2021
